Eliyan raises $60 million for chipset interconnects that accelerate AI chips

Join Gen. AI business leaders In Boston on March 27 For A exclusive night of networking, knowledge, And conversations surrounding data integrity. Request A invite here.

Eliyan has raised $60 million In funding For It is chiplet interconnection technology that speeds up THE treatment For AI tokens.

Samsung Catalyst Funds And Tiger Global Management both directed THE round has help THE team address THE challenges of development of generative AI fleas. Driven by request For AI fleas, industry forecasters are call For robust growth In THE high bandwidth memory (HBM) sector, as a lot as 331% increase This year, follow up by 124% In 2025, according to has walk searcher Fish bone Search.

Eliyan UCIe-, Bow-, Or UMI compliant PHY (double NuLink PHY) addresses memory And I.O. wall constraints on either advance Or standard packaging material. A PHY East A physical layer of THE OSI model. A instantiation of PHY connects A link layer device (often called A MAC) has A physical AVERAGE such as A optical fiber Or copper cable. NOW It is be applied has multichip solutions, which allow chip creators has connect several chiplets on THE even device.

Eliyan chiplet interconnection technology accomplished up has four times THE performance And half THE power of other solutions, THE business said.

THE AI Impact Tour – Atlanta

Continue OUR tour, were headed has Atlanta For THE AI Impact Tour stop on April 10th. This exclusive, invite only event, In Partnership with Microsoft, will functionality discussions on how generative AI East transform THE security Workforce. Space East limit, SO request A invite today.

NuLink PHY East proven on advance process nodes, addresses both Die to die And Die in memory interconnection with It is very effective performance metrics.

Existing investors Also participated In THE round, including Intel Capital, as GOOD as Sask. Hynix, Cleveland Street And Mesh Companies, among others.

THE additional investment follows THE the company $40 million Series A round In 2022. He will enable Eliyan has continue It is to focus on THE most pressing challenges focused towards THE design And manufacturing of advance AI fleas that to use multi-matrix architects In either advance packaging Or standard organic substrates. It is chiplet interconnection technology allow chip creators has reach new levels of performance And power efficiency.

In addition has die to die interconnection In based on chiplets drawings, THE business addresses THE growth challenge of memory ability And bandwidth In AI fleas with It is innovative Universal Memory Interface (UMI). THE bidirectional interconnection method goals has THE "memory wall" issue focused towards big, multi-matrix drawings.

Eliyan co-founders.

"We are thrilled has co-responsible Eliyan Series B r...